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Desired Industry: Engineering SpiderID: 32704
Desired Job Location: Sunnyvale, California Date Posted: 1/13/2010
Type of Position: Full-Time Permanent Availability Date: 01/02/2010
Desired Wage: 170000
U.S. Work Authorization: Yes
Job Level: Management (Manager, Director) Willing to Travel: Yes, Less Than 25%
Highest Degree Attained: Doctoral Willing to Relocate: No


KLA-Tencor, Milpitas, CA 2008 - 2009

Principal Mechanical Engineer

• Design MEMS sensors for wireless Pressure Sensing Wafer on CMP systems within 0.1 psi resolution & 2mm edge exclusion. The linearity & hysteresis of sensor reach the spec, 0.1 psi and kidney-shape edge sensor enable the sensing range to reach 2mm edge.
• Create Hermetic Seal enclosure with thermal mass for TF battery of wireless High Temp Sensing Wafer. Enable battery survived @250C for 90 second. The simulation & experimental results exceed 90 sec to 130 sec.
• Package electronic device for high temp solar application by using insulation material & adding thermal mass. Achieved the goal > 30 min. @400C.

APPLIED MATERIALS, Santa Clara, CA 1998- 2008

Mechanical MTS (Member of Technical Staff)

• Rapid Thermal Process (RTP)/FEP
 Pre-Mozart: In charge entire lower chamber bottom assembly design which mainly includes water cooled / black coated reflector plate & chamber bottom. First ever chamber allows to measure edge ring temp during process. Save $70K on material cost and enable customer demo for future product.
 RadOx Chamber (Best CIP Project Award): Included Base Ring, Triangle Exhaust Assembly and Cartridge. New design spec requires < 1.5% temp NU @900C. Improved temp NU performance from original 3% down to < 0.7%. Also extended operating temp from 950C to 700C. Received 3 orders ($7.5M) from Japan within 3 months after released.
 Mozart Chamber (Best New Product Award): Key components include entire chamber bottom, base ring, rotor well & lamp housing (LH). The existing products not only limited to < 1150C due to poor cooling design on LH, but also lacked low temp control. Mozart Chamber demonstrated @1350C milestone, also enabled low temp control & resulted in superior process data. Engaged new / key customers such as IBM & Intel and increased marketing share ~ 15%.

• Paris (Litho)/ FEG
 Mainly worked on Exhaust System & Filter Assembly of Spin Modules and BCC Thermal Module. Created brand new Flow Control Valve (FCV) to regulate Exhaust System.
 Designed & built Mockup tools to qualify FCV and BCC. Achieved world class spec -- temp NU +/- 0.1 C on BCC.
 Attracted main Litho tools manufacture, DNS, to sign joint venture w/ AMAT. Open up Litho marketing share from 0% to 15%.

 Mainly designed entire platen assembly, slip ring, rotary union and slurry delivery system. Included mechanical, electro-mechanical & fluid delivery systems. Created patented magnetic polishing pad, wafer loss sensor and slurry dispense arm.
 Break thru new marketing area with IBM & received an order for 3 tools ($6.6M) within 6 months after released.

• Polishing Heads / CMP
 Created patented wafer Presence Sensors for Polishing Heads to improve existing sensor’s reliability issue. Reduce sensing error from 10 ~ 25 times/month to ZERO ERROR.
 Troubleshot & improved the reliability & performance on 200mm Tungsten + Head, Titan Profiler, Reflexion, Titan I +, Center Slow & Center Bump Heads ~ 5 - 20%.
 Analyzed & identified the vibration & drooping issues on Centura Robot. Significantly reduced ~ 20% on both.

Ph.D. Mechanical Engineering in Design & Control, Major GPA: 3.9
MS Mechanical Engineering in Heat Transfer, Major GPA: 3.9

MS Mechanical Engineering in Hydraulic & Pneumatic, Major GPA: 4.0, Graduated in 1st place.
BS Mechanical Engineering, Major GPA: 3.8, Graduated in 1st place.

Over 15 years Mechanical Components/Systems Development experience in all phases of product development life cycle. Core strengths include:

• Stress & Strain FEA Analysis
• Thermal Cooling & Insulation

• Hydraulic/Pneumatic Dispense System
• Tooling & Fixture Designs
• GD&T, Tolerance Stack Up
• High Temp Electronics Packaging
• Exhaust Systems
• Sheet Metal, Injection Molding
• Semiconductor Vacuum Chambers
• Leading Development Project & Team

Computer: Computer Languages: FORTRAN
Operating Systems: Unix, MS-DOS, Windows, Macintosh
Software Packages: Solidworks, UG, ProE, ANSYS, COSMOS, AutoCad, TK Solver, Tekscan, Macroflow, ThermalMap, MatLab, Tmap

Languages: English, Mandarin & Taiwanese

Candidate Contact Information: has chosen not to make contact information available on this page.
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