Mask Layout Design - Engineering Resume Search
Mask Layout Design  - Engineering Resume Search
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Mask Layout Design Resume


Desired Industry: Engineering SpiderID: 35371
Desired Job Location: San Jose, California Date Posted: 4/2/2010
Type of Position: Full-Time Permanent Availability Date:
Desired Wage:
U.S. Work Authorization: Yes
Job Level: Experienced with over 2 years experience Willing to Travel:
Highest Degree Attained: Masters Willing to Relocate: No


Objective:
Looking for a challenging and responsible position in IC mask layout design.


Experience:
Summary
- Proficient in custom analog/mixed-signal and RF layout design, particularly at 90nm and 65nm processes technologies.
- Experienced in floor planning, placement and routing of macro blocks, full chip integration and tape out.
- Experienced in physical verification including run file creation, job running, strong debug and problem solving skill for LVS/DRC/ERC and layout issues.
- Ability to work efficiently as a part of team as well as independently with supervisory experience.
Specialties
- Knowledge of Cadence Virtuoso XL, Calibre, Hercules and DRACULA, ASSURA, DIVA verification tools.
- Knowledge of UNIX and Linux systems, Perl and SKILL language code.
- Highly motivated and able to learn and use new CAD tools and methodologies, creative and productive, able manage schedule to deliver projects on time.
- Strong analytical skills and communication skills with circuit design background.
Professional Experiences
September 2009 每 January 2010
Contractor, RF & Analog & Mixed-Signal Mask Layout Design, Qualcomm Inc.
- Maintained full responsibility of mask layout design for an new high performance power detector design and an new Voltage Standing Wave Ratio (VSWR) design to monitor/protect a integrated Power Amplifier used in a Wireless LAN product using 65nm CMOS process
- Chip integration and verification using Cadence and Mentor Calibre CAD tools.
April 2007 每 October 2009
Sr. Staff Analog Layout Design Engineer, Eastman Kodak Company, Sunnyvale, CA
- Maintained full responsibility of layout design for CMOS image sensor chip including floor planning, layout creation for IO*s, bandgap, PLL, ADC, regulator, charge pump, etc. using Cadence-Virtuoso, physical verification using Cadence Assura and Mentor Graphics - Calibre, 0.13um, 0.11um and 0.09um CMOS process.
- Fully responsible for full chip integration and verification for final tape out.
May 2004 每 September 2006
Sr. Layout Design Engineer, OmniVision Technologies, Inc. Sunnyvale, CA
- Maintained full responsibility for CMOS image sensor chip mask layout design including floor planning, layout creation using Cadence-Virtuoso, physical verification using Cadence Assura and Mentor Graphics - Calibre, 0.13um, 0.11um and 0.09um CMOS process.
- Fully responsible for full chip integration and verification (DRC/LVS/ERC) for final tape out.
June 2003 每 May 2004
Sr. Layout Design Engineer, Lattice Semiconductors, San Jose, CA
Lead mask layout design for FPGA chip including floor planning, layout creation for blocks and full chip integration and tape out using Cadence-Virtuoso, physical verification (LVS/DRC) used Cadence Assura and Mentor Graphics - Calibre, 0.13um CMOS process.
Sept 2001 每 Nov 2002
Lead Layout Design Engineer, Spreadtrum Communications, Corp., Santa Clara, CA
- Lead custom layout work of wireless communication chips using Cadence*s Virtuoso layout tool, 0.18um CMOS process. Custom layout includes SRAM, I/O buffers, PLL,
D/A, A/D converters and other mixed-signal blocks.Responsibility includes floor planning, key block layout and top-level integration, DRC/LVS verification using Assura/DIVA, Dracula and Hercules and deliver GDSII database.
- Responsible for full chip physical verification (DRC/LVS/ERC), RC extraction and tape out database.
- Chip floor plan, placement and routing, clock tree synthesis, timing closure and ECO using Avant! Tools.
July 1998 每 Sept 2001
Sr. Staff Physical Design Engineer, Infineon Technologies Corp., San Jose, CA
- Performed custom layout of standard cells, I/O buffers and SRAM*s, PLL, DAC for data-com, networking and DVD chips using Cadence*s IC layout tool, 0.25um and 0.18um CMOS process. Also laid out seal rings, logo etc.
- Creation, debugging and maintain of LVS/DRC/ERC run files and related script files. Run and debug LVS/DRC on standard cell library, I/Os, DAC, PLL, memories and all module blocks and full chip tape out.
- Floor planning, placement and route module blocks using Apollo/Silicon Ensemble, including timing driven layout, clock tree synthesis and ECO, metal fix revision.
- Bonding diagram layout using Infineon*s in-house tool.
October 1994 ㄜ July 1998
Cirrus Logic, Inc. Fremont, California
Sr. Layout Design Engineer
- Layout design for 8 bit DAC, PLL and VCO for graphics chips (135MHz 5V, 175MHz 3.3V) and LAGUNA-3D chip (250 MHz 3.3 V) using Cadence*s IC layout tools.
- Created DRACULA LPE run file and ran layout extraction for back annotation for high-speed mixed-signal circuit design.
- Floor planning, P&R of modules and full chip, running LVS/DRC/ERC for all custom macros and full chip physical verification for final tape out.
Analog Mixed-Signal IC Design Engineer
- Responsible for circuit simulation, design modification and silicon debugging of bandgap voltage reference circuit, which is used as on-chip bias for D/A converter.
- Circuit simulation and design modification for 8-bit DAC, PLL and VCO for graphics chips (135 MHz 5 V, 175 MHz 3.3 V) and LAGUNA-3D chip (250 MHz, 3.3v).
September 1992 每 October 1994
VLSI Design Engineer, Trident Microsystems, Mountain View, California
- Responsible for SRAM circuit simulation and layout design for RAMDAC used in graphics chips.
- Responsible for circuit simulation and layout design for CMOS standard cell library and I/O buffers.
- Responsible for layout design of control logic and data path blocks of graphics chip using symbolic layout technique with Cadence*s EDGE.
- Responsible for chip level floor planning, P&R, post-layout check (DRACULA-LVS/DRC/LPE) and full chip tape out.


Education:
MSEE, major in IC design, Clarkson University, Potsdam, New York
BSEE, major in semiconductor device and physics, Tsinghua University, Beijing, P.R.China


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